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This twofold component epoxy adhesive is designed for curing processes at room temperature, possesses high temperature-resistant properties (100°C), and also high resistance to chemical agents after the post-curing process.
Premium version with improved reactivity and purity.
This epoxy system is designed for medium and high Tg pultrution processes.
This epoxy system is designed for high Tg requirements pultrution processes.
This epoxy system is designed for filament winding processes, cured at high temperature.
This epoxy system is designed for filament winding processes, cured at medium and high temperature.
This epoxy system is designed for filament winding processes and can be cured at room temperature and at medium/high temperature
This Epoxy system is designed for the manufacturing and reinforcement of mega structures via manual process for parts in the automobile industry.
This epoxy system is designed for manual processes, ideal for usage in the manufacturing of wind blades.